Pereiti prie turinio

Micromechanical Electrostatic Relay

Elektronika

It is a micro-scale device with lateral dimensions in the range of tens to hundreds of micrometers; thickness of the microcantilever is about 2.0 µm; contact gap is smaller than 1.5 µm.

Novelty:

In order to strengthen attachment of the microcantilever to the substrate, stepped pyramid-shaped fractal microstructures with high effective surface area formed in the anchor region during fabrication process, which results in improved device reliability.

NORITE DAUGIAU SUŽINOTI APIE ŠĮ SPRENDIMĄ? SUSISIEKITE SU MUMIS!

Nacionalinis inovacijų ir verslo centras
mob. +370 672 65146
el. p. nivc@ktu.lt